Unlock real-time quality control with JEOL’s AI-assisted BSE process monitoring system

In metal additive manufacturing, defects are often discovered only once the build is finished, when fixing them is costly or no longer possible. What if process irregularities could be spotted while the part is still forming, layer by layer?

During the powder bed fusion of metals using an electron beam (PBF-EB/M), in-situ backscattered electron (BSE) imaging makes this kind of visibility possible. By reading the contrast from each solidified layer, the system detects flaws such as pores, and with AI-based object detection it flags them to the operator in near real time.

In this session, we will break down how BSE monitoring works from the ground up: how backscattered electrons are generated and captured during PBF-EB/M, how the physical monitoring setup is built, and how the images themselves are produced. We will then look at concrete use cases for the system, including AI-driven defect detection in action.

Join Davide Sher from VoxelMatters together with Siegfried Bähr from JEOL GmbH for a practical look at how in-situ BSE monitoring brings quality control into the build process itself.

What you will gain

• A clear understanding of how BSE imaging works and why it suits in-situ inspection in PBF-EB/M
• How AI object detection turns BSE images into near real-time alerts on process flaws
• A behind-the-scenes view of the physical monitoring setup and how the images are generated
• Real use cases showing where BSE monitoring adds value, from defect detection to overall process control

Make sure to join on September 10, at 3pm BST | 4pm CEST